This mold features a complex and multifunctional structure that can accommodate various components of a fingerprint recognition device, including the fingerprint sensor, electronic parts, and connecting interfaces. Simultaneously, these structures ensure the rational arrangement of components to achieve optimal performance. Common materials and advantages include:

PC, AS, ABS
Excellent heat dissipation
Temperature and wear resistance
Resistant to breakage from drops
Product highlights:
During mold design, considerations are made for the potential heat generated during the operation of the fingerprint recognition device to ensure effective heat dissipation, preventing overheating that could affect performance. Furthermore, this mold provides excellent insulation properties to safeguard electronic components from external environmental interference.

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